Pulse Packet Sputterng For Layer Optimisation And Arc Handling

Reactive Pulse Magnetron Sputtering (PMS) has been part of the coating industry for many years. This technology allows the reactive sputtering of oxide and nitrite layers with high deposition rates; in particular also the deposition of electrically highly insulating layer materials. Well known variants of PMS are unipolar technology with single cathodes and bipolar technology with dual cathode arrangements. So-called pulse packet sputtering represents a combination of unipolar and bipolar technology, which offers new possibilities to adjust layer properties.