A Practical Electronic Package For Multi-Wavelength Optical Amplifiers

Through efforts to supply components for use in a variety of systems we have come to appreciate the need for a unique packaging technology. Many of our customers require hybrid structures combining fiber-optic and electronic components in a single module or unit. Such modules also must fit some pre-existing physical constraints. Limits are often placed on physical dimensions but such matters as the location and type of electrical inter-connection with the customer's assembly, the management of waste heat from the module and the scheme of mechanical connection also require accommodation in any given design. And of course, all such considerations must not interfere with the function or reliability of the basic (and sometimes complex) optical structure.

Author
J A Demeritt & P G Wigley
Origin
Corning Incorporated
Journal Title
Corning Research 1997 77-81
Sector
Special Glass
Class
S 1432

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A Practical Electronic Package For Multi-Wavelength Optical Amplifiers
Corning Research 1997 77-81
S 1432
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