Atomic layer deposition (ALD) is a variant of chemical vapour deposition (CVD) technology used to grow high-quality thin films through alternate self-limiting surface reactions. ALD technology was developed for commercial use for flat panel displays in the mid-70s, but its applicability for many industrial areas suffered for a long time from a relatively low throughput. Although dielectric films for IC made by ALD are relatively thin, it can be also applied to other industrial areas where thicker films are needed. Due to the unique film growth mechanism, the throughput limitation can nowadays be resolved by increasing batch sizes or using inline tools, depending on the desired thickness. This article describes the basic principles of ALD technology, as well as existing and emerging application areas in the glass industry.
