The performance of tools used in the manufacture of semi-conductors has improved substantially in recent years, thanks mainly to advances in the development of suitable grades of tungsten carbide as well as the introduction of newer tool materials such as DLC (diamond like carbon), used as a coating material. The use of these tool materials has helped to solve the problem of solder sticking to the tools, but another major problem - delamination of the coating - still remains to be solved. Now, however, a Japanese firm, ALMT Corp., has developed tools manufactured using ultra fine CVD diamond coating technology, which it claims to produce optimum results while minimising both solder adhesion and delamination.
Origin
Unknown
Journal Title
Industrial Diamond Review 1/04 53, 55-56
Sector
Special Glass
Class
S 2699